الأجهزة الصناعية والعلمية

Screwdriver Set, 25 in 1 Cellphone Repair Tool Kit Repair Dismantling Tool Kit for Smartphones Tablets Laptops

Type d'article : module d'appareil photo.Modèle : HBV-RPI1508G V11.Longueur focale : environ 3,4 mm.Champ de vision diagonal : 69,1°.Méthode de mise au point : mise au point manuelle.Matériau : PCB.Alimentation : 3,3 V CC.Interface : CSI.

Features Benefits:
Good quality and brand new；Quality switching elements.
Customized high quality connection, using 22AWG wire, copper wire inside is very thick, can be resistant to current 2A, 300V voltage. An insulating layer over a wide range of temperatures, up to 80 degrees. Is the common connection of thin copper wire can not match. Not easy to pull off, plug it convenient, for ease of use, plug the other side to do the one, you can use the direct plug.

Specifications:


Material: Carbon steel


Finished: Zinc plated


Size: T1.5 x 10 x 37 mm


Thread Size: M5


Color: Silver


Mounts with M5 x 4mm Set Screws


Application: For V-Slot Aluminum profile

Pâte à souder mécanique P23, huile spéciale pour la soudure par refusion de puces, réparation PCB BGA, huile de flux de baril illac 10CC

Screen resolution: 800 x 480.Serial interfaceTouch screen type.Controller for display: no.Interface TFT N/ASize of the display 7.0 ?Card measures 181mm x 108mmExpandable.SD card slot.Touch Screen
Weight:400g

Our PLA + filament is a great choice for 3D printing projects. Made with a combination of polylactic acid and other additives, this filament offers superior layer bonding and is ideal for producing parts with increased strength and stiffness.

Special materials specifically engineered for efficient high-speed 3D printing represent a significant innovation in additive manufacturing. High speed filaments complement high-speed 3D printers, extruders and nozzles and trully allow to exploit the potential of fast 3D printing technologies. One such material is the Hi-Speed PLA+