Type d'article : module d'appareil photo.Modèle : HBV-RPI1508G V11.Longueur focale : environ 3,4 mm.Champ de vision diagonal : 69,1°.Méthode de mise au point : mise au point manuelle.Matériau : PCB.Alimentation : 3,3 V CC.Interface : CSI.
Features Benefits: Good quality and brand new;Quality switching elements. Customized high quality connection, using 22AWG wire, copper wire inside is very thick, can be resistant to current 2A, 300V voltage. An insulating layer over a wide range of temperatures, up to 80 degrees. Is the common connection of thin copper wire can not match. Not easy to pull off, plug it convenient, for ease of use, plug the other side to do the one, you can use the direct plug.
Réparation de la tete fer à souder S one, réparateur mécanique, huile rafraîchissante, crème de résurrection, tête de fer à souder propre, protection, désoxydation de l'huile
Our PLA + filament is a great choice for 3D printing projects. Made with a combination of polylactic acid and other additives, this filament offers superior layer bonding and is ideal for producing parts with increased strength and stiffness.
Special materials specifically engineered for efficient high-speed 3D printing represent a significant innovation in additive manufacturing. High speed filaments complement high-speed 3D printers, extruders and nozzles and trully allow to exploit the potential of fast 3D printing technologies. One such material is the Hi-Speed PLA+
Processeur : Intel Core i3 (6ème génération) Taille installée : 4Go ( HDD/ 500 Go Processeur graphique : Intel HD Graphics 4400 Dynamic Video Memory Technology Interfaces : 4 x USB 3.0 (2 à l'avant ET 2 à l'arrière), 2 x USB 2.0 (2 à l'arrière), 1 x VGA, 1 x DisplayPort, 1 x casque (1 à l'avant), 1 x microphone (1 à l'avant), 1 x LAN (Gigabit Ethernet) ,1X DB9
19 900,00 DZD
24 500,00 DZD
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